Huixun Electronics
Huixun Electronics
Huixun Electronics

PRODUCTS CENTER

APPLICATION  AREA

Because of the wide application of digital circuits in automobiles, there is a large demand for crystal oscillators

In the research and measurement, crystal oscillators are mostly used for celestial navigation and space tracking

Crystal oscillator is indispensable for all kinds of electronic facilities around ordinary people and large industrial equipment

From various electrical appliances to various electric meters, computer motherboards, electronic watches, etc

Why Choose Us?

2012

Founded in 2012

20million

Registered capital

2200

Plant area

56

Company staff

2012

Founded in 2012

20million

Registered capital

2200

Plant area

56

Company staff

ABOUT US

Scientific and technological innovation, customer satisfaction; Continuous improvement and sustainable operation

Tangshan Huixun Electronic Technology Co., Ltd

Tangshan huixun Electronic Technology Co., Ltd., established in April 2012, is a high-tech enterprise invested and built by Shenzhen Huijing Electronic Technology Co., Ltd.

 

The company is mainly engaged in the production and sales of quartz crystal resonators and quartz crystal oscillators. The products are exported to Europe, America, Southeast Asia, Hong Kong and Taiwan, and are widely used in military industry, aviation, automobile, communication, detection, computer, mobile phone, GPS, program-controlled switch, instrument and other fields.

 

 

Huixun Electronic Technology

NEWS CENTER

Integrated circuit EUV technology innovation draws semiconductor blueprint

Integrated circuit EUV technology innovation draws semiconductor blueprint

Semiconductor scaling (Scaling) is one of the hottest topics in the semiconductor industry. As most electronic components and storage units, including DRAM and other chip components, tend to be ultra-miniaturized, the demand for highly integrated technology is gradually increasing, and ultra-small chips will be able to store and quickly process astronomical amounts of data . Today, the core of semiconductor scaling (Scaling) is a new generation of exposure technology - Extreme Ultra Violet (Extreme Ultra Violet, referred to as EUV) technology. "Moore's Law is over" Semiconductor miniaturization technology is in a bottleneck Semiconductor miniaturization has entered the 10-nanometer era, and the previous "Multi Patterning" technology no longer works. Because, in the 10-nanometer chip manufacturing process, the previous argon fluoride exposure technology (Argon Fluoride, ArF for short) has fallen into a bottleneck. To date, the semiconductor industry has followed the "Moore's Law" of doubling chip integration every 24 months. However, as the lithography process becomes more and more difficult, Moore's Law, which was once brilliantly used, will eventually be eliminated. The photolithography process is one of the semiconductor manufacturing processes that use lasers to draw ultra-micro circuits on the wafer. The process of transferring the circuit pattern to the wafer is similar to the process of making traditional photos. Therefore, the English word "photolithography process" has "Photo". word. "Photolithography" is a pattern transfer and copying technology, which realizes the appearance of an The shadow copy is transferred to the wafer. This formation of pre-designed patterns on wafers is a key process in semiconductor manufacturing. In this process, the fineness of the circuit pattern is a decisive factor for the competitiveness of semiconductor technology. "Scaling", that is, reducing the length of the gates of transistors in semiconductor circuits, has always been regarded as the most important issue in the industry. The transistor switch is like a bridge connecting the source and drain stages, and it is the valve that regulates the current. Therefore, the shorter the length of the switch, the greater the number of electrons flowing from the source to the drain, and the correspondingly faster the circuit runs. In recent years, semiconductor exposure equipment has developed rapidly, and all use larger lenses or short-wave light sources with high numerical aperture (NA). But existing liquid immersion argon fluoride exposure equipment (ArF) will reach its limit when the gate length shrinks below 30 nanometers. DRAM chips up to 18 nanometers use multiple imaging technologies, but this will increase the number of processes, reduce productivity, and increase material costs, resulting in increased costs. When the number of processing steps reaches 500-600, it can be seen that the technology has come to an end. The only solution to this problem relies on short-wave light, drawing circuits with finer "slim strokes".
Principles and Characteristics of Quartz Crystal Resonators

Principles and Characteristics of Quartz Crystal Resonators

Quartz crystal resonator is an oscillator with high precision and good stability, which is widely used in radar, navigation, telemetry, radio, instrumentation and other fields, as well as frequency generators in communication systems, clock signals of data processing equipment and specific system reference signal. The basic principle of quartz crystal resonator: 1. The structure of the quartz crystal resonator Quartz crystal resonator is a resonant device made of piezoelectric effect of time-responsive crystal (silicon dioxide crystal). Its basic structure is roughly as follows: a slice is cut from the crystal at a certain azimuth angle (referred to as the slice can be a square, a rectangle or a circle, etc.), and a silver layer is coated on its corresponding two surfaces as electrodes, Solder a lead to each electrode to connect to the pin, and add an encapsulation case to form a quartz crystal resonator, abbreviated as a time crystal or. Its products are generally packaged in metal casings, but also in glass casings, ceramics or plastics. 2. Piezoelectric effect If an electric field is applied to the two electrodes of the crystal at the same time, the wafer of the quartz crystal resonator will be mechanically deformed. Conversely, if mechanical pressure is applied to both sides of the wafer, an electric field is created in the corresponding direction of the wafer, a physical phenomenon known as the piezoelectric effect. If an alternating voltage is applied to the two poles of the wafer, the wafer will generate mechanical vibration, and the mechanical vibration of the wafer will generate an alternating electric field. In general, the amplitude of the mechanical vibration of the wafer and the amplitude of the alternating electric field are very small, but when the frequency of the applied alternating voltage is a certain value, the amplitude increases significantly, which is much larger than other frequencies. This phenomenon is called piezoelectric resonance and is very similar to the resonance phenomenon of LC circuits. Its resonant frequency is related to cutting method, geometry and wafer size. 3. Symbols and Equivalent Circuits When the crystal of the quartz crystal resonator does not vibrate, it can be regarded as a flat capacitance, which is called electrostatic capacitance c, and its size is related to the geometric size of the wafer and the electrode area, generally ranging from a few PF to several tens of PF. When the crystal oscillates, the inertia of mechanical vibration can be equivalent to the inductance l, and the general value of l is tens of mH to hundreds of mH. The elasticity of the wafer can be equivalent to the capacitance c, and the value of c is very small, generally only 0.0002~0.1pF. The loss caused by friction when the wafer vibrates is equivalent to R, and its value is about 100 . Because the equivalent inductance of the chip is very large, C is very small, and R is also very small, so the quality factor Q of the loop is very large, which can reach 1000~10000. In addition, the resonant frequency of the wafer itself is basically only related to the cutting method, geometry and size of the wafer, which can be fabricated. Therefore, generally speaking, the oscillator circuit composed of quartz crystal resonators can obtain higher frequency stability.
What are the characteristics of EMXO vacuum micro crystal oscillator?

What are the characteristics of EMXO vacuum micro crystal oscillator?

OCXOs (Oven Controlled Crystal Oscillators) are used when the frequency and temperature requirements are too stringent to be met by a basic XO (crystal oscillator) or TCXO (temperature compensated crystal oscillator). When using an OCXO, the temperature of the crystal and critical circuits will remain constant as the temperature outside the oscillator changes. Controlling the temperature inside the oscillator with an oven keeps the temperature constant. In an OCXO, changes in ambient temperature are sensed and then fed back to the oven controller, which is A constant optimum temperature is maintained continuously inside the oscillator housing. OCXO can increase the inherent stability of the crystal by more than 5000 times. The oven control system is not perfect, the open loop gain is not infinite, there is an internal temperature gradient inside the oven (oscillator), Whereas in a conventional oven, the circuitry of the oven casing is affected by changes in ambient temperature. 'pull' the frequency. Compared with XO or TCXO, the temperature stability performance of traditional OCXO is greatly improved. For example, OCXO power consumption is greater than 200 times. There is also a size consideration. In ordinary OCXO, the crystal is packaged in a metal case, This is then put into an oven enclosure along with the temperature sensitive circuitry and then surrounded by thermal insulation. Then all of this and any additional circuitry is placed in a metal enclosure into a bulky package which becomes very difficult to miniaturize. In order to Overcoming these obstacles, the EX-380 series EMXO (Vacuum Micro-Oven Controlled Crystal Oscillator) was specifically developed to achieve OCXO performance while significantly reducing power consumption and packaging size

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About 70 meters west of happy island natatorium, Ziwu street, Yutian County, Tangshan

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